Bondline supplies high quality performance epoxy adhesives to companies in the semiconductor, medical device, microelectronic, and aerospace industries.
Bondline manufactures cutting-edge specialty adhesive materials that solve complex problems.
1：Medical Grade Adhesives
We manufacture medical grade adhesives including USP Class VI compliant, catheter assembly, sterile disposables, transducer assembly, diagnostic equipment, needle assembly, ultrasound, optically clear other medical electronics.
2：Packaging Adhesives
Adhesives meeting CSP requirements as a manufacturer and Supplier of Reliable and High Performance Film and Paste Adhesives, Compliant and Low Outgassing Adhesives, Thermal Dissipation (Management) Adhesives, Die Attach Adhesives, Underfill Adhesives, Interposer Adhesives
3：Electronic Grade Adhesives

Bondline 為半導(dǎo)體、醫(yī)療設(shè)備、微電子和航空航天行業(yè)的公司提供高質(zhì)量的環(huán)氧樹脂粘合劑。

Bondline 生產(chǎn)解決復(fù)雜問題的尖端特種粘合劑材料。 1：醫(yī)用級膠粘劑 我們生產(chǎn)醫(yī)療級粘合劑，包括符合 USP VI 類標準的導(dǎo)管組件、無菌一次性用品、換能器組件、診斷設(shè)備、針頭組件、超聲波、光學(xué)透明其他醫(yī)療電子產(chǎn)品。 2：包裝膠 作為可靠和高性能薄膜和糊狀粘合劑、合規(guī)和低釋氣粘合劑、散熱（管理）粘合劑、芯片連接粘合劑、底部填充粘合劑、中介層粘合劑的制造商和供應(yīng)商，粘合劑滿足 CSP 要求 3：電子級膠粘劑 我們生產(chǎn)電子級粘合劑，包括芯片貼裝、SMT、散熱器、底部填充、封裝。

以上如有需要請致電13922125860（微信同步）