廣州市銀標(biāo)貿(mào)易有限公司
聯(lián)系人：賴先生
手機(jī)：13922125860
固話：+86-20-23830796 23830403
傳真：+86-20-34637699
網(wǎng)址：www.pc-ic.com
郵箱：laiqiangping2010@163.com
地址：廣州市番禺區(qū)鐘村鎮(zhèn)鐘榮路1號致業(yè)科技中心A棟3樓AS388#
EPO-TEK? H22 is a two component, silver-filled epoxy system designed specifically for die bonding and sealing hybrid circuit packages.
| Electrical | |
| Electrical, Thermal | |
| Oven, Snap | |
| 2 | |
| 16 Hours | |
| 12,000-20,000cPs @ 20 rpm | |
| =100°C | |
| 2.36 | |
| 150°C/5 min 120°C/10 min 100°C/20 min 80°C/45 min | |
| =5 kg | |
| 0.94 W/mK | |
| 39 x 10-6 in/in/°C (below Tg) | |
| N/A | |
| N/A | |
| 80D | |
| N/A | |
| Electronics Assembly, Hybrid, Medical | |
| Circuit / Electronic Assembly, Electrically Conductive, Heat Sinking, Hybrids Microelectronics, LCDs, LEDs, PCB Level Materials, Semiconductor , Solder Replacement, Wafer Level |
